Micron Picks Bechtel to Build the First Phase of Its $100B New York Megafab

Micron’s central New York megafab just got its builder. The chipmaker announced June 10 that it selected Bechtel as engineering, procurement and construction contractor for the first phase of its semiconductor campus in Clay, New York, the step that moves the project from planning into full-scale construction.

The campus is the centerpiece of Micron’s plan to invest up to $100 billion in central New York over the next two decades. State and company projections put job creation at about 50,000 statewide, including more than 4,500 in construction at peak.

Why the EPC award matters

Naming an EPC contractor is the moment a megafab gets real. Bechtel now owns the integrated job of designing, buying long-lead equipment for, and building cleanroom space measured in the millions of square feet. Few firms can run a semiconductor project at this scale, and Bechtel has done it before, including Micron’s other U.S. work. Gilbane handled earlier site preparation, the ground game that has to finish before vertical construction starts.

The chip-fab build-out continues

Micron’s Clay campus sits alongside a national wave of fab construction that includes its own New York site and competitors’ projects in Arizona, Texas and Ohio. These are the longest, most complex industrial jobs in the country right now, and they’re concentrating advanced-construction talent in a handful of metros. An EPC award like this one locks in years of work. Reporting via ENR.

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