TSMC’s Phoenix fabs solved half of the domestic chip problem. Wafers still had to leave the country to be packaged and tested. Amkor’s Peoria campus is the other half.
Project Scope
Amkor broke ground on October 6, 2025 and used the same event to raise the announced investment from roughly $2 billion to $7 billion across two phases, an increase of more than $5 billion. The campus occupies an initial 56-acre parcel with room to grow to 104 acres in Peoria’s Innovation Core, off Lake Pleasant Parkway near Loop 303.
Completed, the two phases deliver more than 750,000 sq ft of cleanroom and as many as 3,000 permanent jobs in engineering, operations and advanced manufacturing. Vertical construction on the roughly $1 billion first phase started in January 2026. That building is due mid-2027, with production beginning in early 2028. Peak construction headcount is estimated above 2,000 workers.
SSOE Group is the engineer and Okland Construction is the contractor. Amkor has not disclosed an architect or a delivery method. The plant is designed around smart-factory systems and scalable lines aimed at AI, high-performance computing, mobile and automotive parts.
Why It Matters
Advanced packaging is where a lot of modern chip performance actually comes from. Stacking and interconnecting die is no longer a commodity back-end step, and until now the U.S. had no high-volume capacity for it. Amkor is the largest U.S.-headquartered OSAT provider, based in Tempe, and this will be the biggest and most advanced outsourced packaging plant in North America.
The customer list explains the size. Apple COO Sabih Khan said the facility will package and test Apple silicon fabricated at TSMC Arizona “just down the road,” as part of Apple’s $600 billion U.S. commitment. NVIDIA parts are also in scope. The Commerce Department pledged $407 million in direct CHIPS funding, and the project stacks the Advanced Manufacturing Investment Tax Credit, Apple’s American Manufacturing Program and state and local incentives on top of private capital.
Amkor moved the project off an earlier Peoria site to land a bigger parcel, then bought additional adjacent ground. That sequence is worth noting for anyone bidding semiconductor work: the program grew three times before a single column went up, and the site had to absorb it.
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Project Team & Details
| Developer | Amkor Technology, Inc. |
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| Owner / Client | Amkor Technology, Inc. |
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| Consultants | SSOE Group (Engineering) |
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| General Contractor | Okland Construction |
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| Status | Under Construction |
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| Funding Source | Mixed |
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